| Customization: | Available |
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| Metal Coating: | Tin |
| Mode of Production: | SMT & DIP |
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Audited Supplier Audited by an independent third-party inspection agency
1. One stop contract manfacturing
2. Quick turn prototype PCB Assembly
3. Profesional engineer team to analyze Gerber before production
4. No MOQ, we accept small order as well as mass production
5. Free chips programming
6. Components sourcing, 100% original brand negative parts
7. Fast response
8. Reliable after-sales service
| PCB Item | Manufacture Capacity |
| Layer Counts | 1-40L |
| Base Material | FR4,High-TG FR4, Aluminum, High Frequency, CEM3 |
| Material Thickness | 0.4-3.2mm |
| Max board size | 1200×400mm |
| Board Outline Tolerance | ±0.15mm |
| Thickness Tolerance | ±8% |
| Minimum line / space | 0.1mm |
| Min Annular Ring | 0.1mm |
| SMD Pitch | 0.3mm |
| Holes | |
| Min. Hole Size (mechanical) | 0.2mm |
| Min. Hole Size (laser hole) | 0.1mm |
| Hole Size Tol | PTH: ±0.075mm; NPTH: ±0.05mm |
| Hole Position Tol | ±0.075mm |
| Plating | |
| HASL / LF HAL | 2.5um |
| Immersion Gold | Nickel 3-7um Au: 1-5u" |
| Surface finished | HAL, ENIG, Plated Gold, Immersion Gold, OSP |
| Copper | |
| Copper weight | 1-6OZ |
| Color | |
| Solder mask | Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black |
| Silk screen | White, Black, Blue, Yellow, Red |
| PCBA | Production Capability |
| Stencil Size | 736 × 736mm |
| Minimum IC Pitch | 0.2mm |
| Maximum PCB size | 1200 × 500mm |
| Minimum PCB thickness | 0.25mm |
| Minimum Chip size | 0201 (0.2×0.1) |
| Maximum BGA size | 74 × 74mm |
| BGA ball pitch | 1.00mm (minimun), 3.00mm (maximum) |
| BGA ball diameter | 0.4mm (minimun), 1.00mm (maximum) |
| QFP lead pitch | 0.38mm (minimun), 2.54mm (maximum) |
| Volume | One piece to low volume production quantities |
| Low cost first article bulids | |
| Schedule deliveries | |
| Assembly type | Surface mount assembly (SMT) |
| DIP assembly | |
| Mixed technology ( Surface mount and through hole ) | |
| Single or double sided placement | |
| Cable assembly | |
| Components type | Passive components |
| As small as 0402 package | |
| As small as 0201 with design review | |
| Ball Gid Arrays (BGA) | |
| As small as 0.5mm pitch | |
| Parts procurements | Turnkey (We supply the parts) |
| Consigned (You supply the parts) | |
| You supply some parts, we do the rest. | |
| Solder type | Leaded |
| Lead-free/ ROHS compliant | |
| Other capacilities | Repair / rework services |
| Mechanical assembly | |
| Box build | |
| Mold and plastic injection |
Q1: What service do you have?
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