| Customization: | Available |
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| Metal Coating: | Gold |
| Mode of Production: | SMT & DIP |
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| PCB Item | Manufacture Capacity |
| Layer Counts | 1-40L |
| Base Material | FR4,High-TG FR4, Aluminum, High Frequency, CEM3 |
| Material Thickness | 0.4-3.2mm |
| Max board size | 1200×400mm |
| Board Outline Tolerance | ±0.15mm |
| Thickness Tolerance | ±8% |
| Minimum line / space | 0.1mm |
| Min Annular Ring | 0.1mm |
| SMD Pitch | 0.3mm |
| Holes | |
| Min. Hole Size (mechanical) | 0.2mm |
| Min. Hole Size (laser hole) | 0.1mm |
| Hole Size Tol | PTH: ±0.075mm; NPTH: ±0.05mm |
| Hole Position Tol | ±0.075mm |
| Plating | |
| HASL / LF HAL | 2.5um |
| Immersion Gold | Nickel 3-7um Au: 1-5u" |
| Surface finished | HAL, ENIG, Plated Gold, Immersion Gold, OSP |
| Copper | |
| Copper weight | 1-6OZ |
| Color | |
| Solder mask | Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black |
| Silk screen | White, Black, Blue, Yellow, Red |
| PCBA | Production Capability |
| Stencil Size | 736 × 736mm |
| Minimum IC Pitch | 0.2mm |
| Maximum PCB size | 1200 × 500mm |
| Minimum PCB thickness | 0.25mm |
| Minimum Chip size | 0201 (0.2×0.1) |
| Maximum BGA size | 74 × 74mm |
| BGA ball pitch | 1.00mm (minimun), 3.00mm (maximum) |
| BGA ball diameter | 0.4mm (minimun), 1.00mm (maximum) |
| QFP lead pitch | 0.38mm (minimun), 2.54mm (maximum) |
| Volume | One piece to low volume production quantities |
| Low cost first article bulids | |
| Schedule deliveries | |
| Assembly type | Surface mount assembly (SMT) |
| DIP assembly | |
| Mixed technology ( Surface mount and through hole ) | |
| Single or double sided placement | |
| Cable assembly | |
| Components type | Passive components |
| As small as 0402 package | |
| As small as 0201 with design review | |
| Ball Gid Arrays (BGA) | |
| As small as 0.5mm pitch | |
| Parts procurements | Turnkey (We supply the parts) |
| Consigned (You supply the parts) | |
| You supply some parts, we do the rest. | |
| Solder type | Leaded |
| Lead-free/ ROHS compliant | |
| Other capacilities | Repair / rework services |
| Mechanical assembly | |
| Box build | |
| Mold and plastic injection |
Q1: What service do you have?
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